Packaging Development Engineer

NXP-Manufacturing-(Thailand)-Ltd.

NXP-Manufacturing--Ltd. (Lak Si)

กรุงเทพ, ประเทศไทย 🇹🇭

NXP Manufacturing (Thailand) Ltd., established in Bangkok in 1974, operates as a modern semiconductor facility specializing in the assembly and testing of integrated circuits (ICs). With a production area spanning 55,220 square meters, the company is dedicated to manufacturing standard products, microcontrollers, and mixed-signal ICs for markets such as automotive, secure banking, mobile audio, and standard logic. Their commitment to quality, supported by a team of over 3,600 members, ensures the production of high-quality ICs for the global electronics market. NXP Thailand fosters an environment where team members feel valued and can grow their competences, making it an excellent workplace choice

การวิจัยและพัฒนา

การผลิตและการผลิต

เกี่ยวกับตำแหน่งนี้

The Package Development Engineer will be responsible for the development, design and characterization of advanced packages for power semiconductors and electronic components for power conversion applications.

คัดลอกลิ้งค์

คัดลอกแล้ว

หน้าที่รับผิดชอบ

• Establishing the methodology for developing new package platforms and optimization of qualified packages for new products and multichip semiconductors, ICs and passive components.
• Planning and execution of tactical and strategic projects to meet product and technology roadmaps.
• Working as an integral part of technology and product development project teams, working seamlessly with design centers, and engaging research institutions.
• Anticipating and resolving materials and technical challenges with new products.
• Contributing to innovative package concepts, mechanical design, and IP generation using a variety of packaging techniques based on metal frame, laminate or BGA.

คุณสมบัติ

• Hands-on experience in package development position familiarity with automotive requirements is highly considered.
• 3-10 experience in Semiconductor packaging.
• Demonstrated experience in package design using MCM, MLF, QFP/N, B/LGA, CSP, SO.
• Strong background in materials science and thermo-mechanical properties, and deep knowledge of the interactions of the material between semiconductors, die attachments, substrates, passivates and mold compounds.
• Ability to conduct failure analysis and determine root cause.

สิทธิประโยชน์

Huneety A.I Salary Estimate
38,000 - 60,000 THB per month

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