Senior Packaging Development Engineer
About this position
The Senior Packaging Development Engineer will be responsible for developing advanced packages for power semiconductors and electronic components for power conversion applications.
Responsibilities
• Establish the methodology for developing new package platforms and optimizing qualified packages for new products and multichip semiconductors, ICs, and passive components.
• Plan and execute tactical and strategic projects to meet product and technology roadmaps.
• Work as an integral part of technology and product development project teams, collaborating with design centers and research institutions.
• Anticipate and resolve materials and technical challenges with new products, including thermal and electrical efficiency, materials mismatch issues, adhesion, and manufacturing cost.
• Contribute to innovative package concepts, mechanical design, and IP generation using various packaging techniques based on metal frame, laminate, or BGA.
Requirements
• Hands-on experience in package development with familiarity with automotive requirements.
• 3-10 years of experience in Semiconductor packaging.
• Demonstrated experience in package design using MCM, MLF, QFP/N, B/LGA, CSP, SO, etc.
• Strong background in materials science and thermo-mechanical properties, with deep knowledge of material interactions.
• Ability to conduct failure analysis, determine root cause, and knowledge of development and production using contract manufacturing.
Benefits
38,000 - 60,000 THB per month